CTO Yosef Ben Ezra shares our perspective on the possibilities for PICs and optical connectivity in the AI era
By all accounts the photonics ecosystem is experiencing a pivotal year in advancing optical technologies to address the rapidly increasing burden of AI workload processing on data centers. The buzz this year is more audible than ever and the message is clear: optics is on the roadmap for big leaps in connectivity performance.
In this month’s issue of Photonics Spectra our CTO Yosef Ben-Ezra conveys our point of view on PIC innovation for today and in the future of linear pluggable optics (LPO) with advanced all optics equalizer and the challenges that must be overcome through more collaboration and energy from the entire silicon ecosystem.
The article hints at the range of possible fields where innovation may come and lead, as well as the impact of photonics beyond connectivity. But it more deeply focuses on technology designed and built in the optical domain to address today’s imperative for latency and power improvements with direct impact on data compute and transmission performance.
From photonics integration to the necessarily apparent advantages of optical interconnect beyond traditional PIC limitations, the article offers readers a new perspective on the way forward at the heart of PIC innovation highlighting the range of contributions required by companies large and small.
We encourage our peers, customers and partners to read this latest installation of informative articles on integrated photonics in the year of the PIC. Explore this thematic look at photonics integrated circuits as an important growth area in signal processing. Share your thoughts with us on the article topic – contact us with your comments and open up a deeper discussion on the latest advances in data transmission in the optical domain.
