HVM Advantage: Adopting yieldHUB Analytics Platform to Drive PIC Quality and Reliability

This week yieldHUB, the industry’s leader in advanced yield management and semiconductor analytics solutions, announced our adoption of the company’s advanced data analytics models, heterogeneous test flows, and rapid root-cause identification capabilities across multiple silicon photonics products in development.

This is an important milestone as we continue to lead the shift to energy-efficient photonics connectivity in data center pluggable, NPO and CPO connectivity. We selected yieldHUB as our primary data-analysis tool to further enable superior quality and reliability in high-volume PIC production.

The awareness and urgency for mass production of highly integrated photonic integrated circuits in LPO, NPO and CPO chip solutions is escalating as demand for optical connectivity solutions gains momentum.

We’re delivering multiple photonics-based products designed to optimize PIC packaging, test schemes and reliability that will improve time-to-market of silicon photonics solutions for optical interconnect. Increased device complexity and manufacturing variability across photonics processes is a hurdle the entire ecosystem faces as we work to meet the scale demand driven by AI compute and interconnect in the hyperscale data center.

By correlating electrical, optical, and reliability data using automation in one unified platform, yieldHUB enables us to achieve better yield, reliability, and time-to-market goals in leading-edge photonic devices.

The tool feature set includes a key data visualization we use to identify areas to apply engineering and process improvements that will accelerate improved yield outcomes. The zonal yield analysis helps engineers calculate deltas between regions on the wafer to clearly categorize patterns and identify issues.

yieldHUB zonal yield analysis data visualization without the specific data set numbers from the NewPhotonics use case.
A data visualization using the yieldHUB advanced yield management and semiconductor analytics solution (actual NewPhotonics data set numeric values removed)

John O’Donnell, Founder and CEO of yieldHUB said the collaboration reflects a shared focus on engineering excellence.

“We’re delighted to welcome NewPhotonics as a customer. Photonic chips introduce unique yield challenges and our analytics platform is purpose-built to give engineering teams deep visibility and insights into test data and long-term reliability risks,” Mr. O’Donnell said.

“From the outset, it was clear that both teams share a commitment to pushing technical boundaries, particularly in how AI can be applied to improve efficiency and reliability. We look forward to supporting NewPhotonics as they drive scale production of high-quality photonics products into the market.”

This level of discipline in analytics intelligence is essential to scaling chip infrastructure to meet data center capacity with confidence. And we view the yieldHUB platform as the analytics backbone necessary to convert complex electrical, optical, and reliability data into actionable insight that will reinforce supply-chain control and enable predictable, high-volume production for the most demanding AI workloads.

Since 2005, yieldHUB has been a leading provider of advanced yield management and semiconductor analytics solutions, trusted by engineering teams at the world’s most innovative semiconductor companies.

Photonics is redefining how data travels, through light instead of electricity. yieldHUB helps photonics manufacturers overcome the unique testing and analysis challenges of opto-electronic devices, from laser diodes to photo detectors and optical transceivers.

yieldHUB enables engineers to improve yield, reliability, and time-to-market for the next generation of photonic devices.

We are an award-winning fabless semiconductor delivering innovative photonic IC chips for AI-era data center scale-out and scale-up interconnect. The company’s laser-integrated PICs and OSPic™ all-optical signal processor enable market-disrupting energy efficiency and production simplicity for DSP and LPO+™ pluggable, NPO, and CPO chip solutions. We also recently announced the industry first and only heaterless MRM solution for CPO.

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