The future of photonics integration for 1.6Tbps is here! We are making news again with our monolithically integrated lasers in advanced transmitter on chip solutions for optical connectivity in the AI-era data center.
On our all-optics innovation roadmap the NPG102 for 1.6Tbps DSP-based modules is putting current data center infrastructure on an accelerated path to a future of low latency and low power connectivity. This addition to our NPG102 family of transmitter on chip products expands the range of transceiver solutions for data center infrastructure beyond our core offering announced in March for the promising LPO-pluggable optics segment.
“As data centers worldwide strive to accelerate infrastructure improvements that enhance AI workload performance, the entire value chain is seeking progressive solutions that deliver faster and more energy efficient data processing.” said Doron Tal, senior vice president and general manager of Optical Connectivity.
In this latest announcement we introduce the advantages of our optical head low power, low latency NPG102 PIC transmitter on chip (TOC) for DSP-based transceivers. Accelerated AI and high-performance compute (HPC) demands on data center infrastructure is elevating the urgency for transition to fast and energy efficient 1.6Tbps transmit possible in optical signal processing. Our NPG102 PIC with integrated lasers and modulators brings breakthrough performance in data center network and compute.
Key features of the NPG102 PIC TOC for DSP-based modules include:
- Optimized flip-chip integrates octal channel, auto-tunable lasers
- 224Gbps PAM4 modulation featuring aggregated bandwidth at 1.6Tbps with electrical to optical transmission
- Internal channel control and monitoring in a package with on-chip temperature monitoring
- Low 2.9W power consumption
Integrated Lasers Advantage Reaches Up the Value Chain
The laser integration benefits module OEM production as well. The design for pluggable OSFP modules improves system integration with wafer-level laser alignment and integrated direct modulation, resulting in accelerated OEM manufacturing yield maturity and time to market for transceiver modules.
The NewPhotonics NPG102 PIC transmitter-on-chip for DSP-based transceiver modules is available in our Early Access Program with market availability expected in the second quarter of 2025.
Read the full press release here.
