We Broke the CPO Thermal Barrier: Introducing Syncra™ Heaterless Micro-Ring Modulator

The hyperscaler data center industry is in a race against continuous and massive AI adoption to redefine a native optical interconnect for AI scale-up. A viable co-packaged optics (CPO) roadmap must be drawn to address its most significant roadblock — rising thermal stability challenges as power consumption increases — with technology that optimizes backend interconnects […]

Next Gen Scaling in the AI Factory: Introducing the Industry-First 3.2T 400G Transmitter-on-Chip

NewPhotonics NPG10240 3.2T 448G PIC for AI Factory Interconnect Scale-Up

The AI Factory is no longer a conceptual blueprint; it is the current reality of hyperscale infrastructure. As large language models (LLMs) grow in complexity, the underlying network must evolve from merely “connecting servers” to becoming a seamless, high-bandwidth backplane for massive GPU clusters. Today, NewPhotonics announced a major leap in this evolution: NPG10240, the […]

On The Road to CPO: NPO for High-Demand Bandwidth in Energy-Efficient Interconnect

The race to evolve beyond the electrical limitations of Moore’s Law is on. All attention has turned to bringing complex new CPO systems to market that will maximize data consumption in more power-efficient data center infrastructure. In the future, co-packaged optics will be the linchpin for AI factory expansion, from predominantly electrical to full-scale electro-optics. […]

Inspiring the Shift to Energy Efficient Photonics Connectivity in Data Center CPO and Pluggables

The industry is increasingly adopting silicon photonics to overcome power and capacity limitations burdened by AI across data centers worldwide. Recognition that silicon photonic integrated circuit (SiPIC) solutions offer higher bandwidth and improved energy efficiency compared to traditional electronic interconnects is taking hold as demand for AI-driven data tools and content continues to grow exponentially. […]

BREAKING NEWS: Centera Announces 1.6T DSP Module with NPG102 Chip

Centera Photonics and NewPhotonics celebrate annnouncement of 1.6T module with NPG10201 PIC TOC

We kicked off year three of NewPhotonics demos at the Optical Fiber Communications conference (OFC50) this week with breaking news from our customer Centera Photonics. This morning Centera introduced the industry-first advanced DSP based 1.6 terabits per seconds (1.6T) transceiver module featuring the highly integrated NewPhotonics NPG10201 PIC transmitter-on-chip (TOC). This collaboration between Centera and […]

Built for Interop: LPO+ Link Training for the Data Center Network

Data centers worldwide are struggling to support on-demand AI model inference and training, primarily due to cost and power constraints. The demand for training AI models with billions of parameters and handling large-scale consumer interactions — from generative models to recommendation systems — has strained infrastructure and pushed the need for cost-effective and energy-efficient solutions. […]

It’s an Honor: NewPhotonics Joins Israel Innovation Dream Team

Peres Center for Peace

We are honored to stand alongside Israel’s leading companies and contribute to the nation’s thriving innovation ecosystem in an educational experience at the Israeli Innovation Center. For the next year we will be featured among a group of 45 startups selected to the prestigious Israel Innovation Dream Team. This exclusive initiative led by the Peres […]

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