Shift to All-Optical
Gain energy, bandwidth and cost efficiencies with state-of-the-art photonic IC chip solutions for scale-out and scale-up interconnect.
Discover the All-Optical Advantage
Your first-to-market optical signal processing chip innovation that delivers energy, bandwidth and manufacturing performance advantages.
Scale with highly integrated photonic ICs built for low power, low latency and reliability at volume.
Reclaim Control over Energy Challenges
Ultra-low power performance for more efficient energy consumption.
Realize All-Optical Signal Processing
Innovative optical signal processing integration for signal speed, integrity and interop.
Reach Scale Volume and
Reliability
Heterogeneous laser integration with efficient laser coupling for high output.
NPG102 Series for DSP Pluggable Optics
High-performance optical head transceiver on chip for DSP-based pluggables at 1.6T and 800G bandwidth.
2.5W reduction in power consumption
224Gbps PAM4 modulation
Heterogeneous laser integration
NPG102 Series for DSP Pluggable Optics
High-performance optical head transceiver on chip for DSP-based pluggables at 1.6T and 800G bandwidth.
2.5W reduction in power consumption
224Gbps PAM4 modulation
Heterogeneous laser integration
LPO+™ NPG102 Series with Optical Equalizer
LPO+ chip solutions with integrated, programmable optical equalizer for 1.6T and 800G linear pluggable optics (LPO) transceiver modules.
Built for interop – LPO-MSA compliant with multi-vendor link management
Low power LPO design up to 50% reduced consumption
Low latency optical signal processing
Heterogeneous laser integration
224Gpbs PAM4 modulation
LPO+™ NPG102 Series with Optical Equalizer
LPO+ chip solutions with integrated, programmable optical equalizer for 1.6T and 800G linear pluggable optics (LPO) transceiver modules.
Built for interop – LPO-MSA compliant with multi-vendor link management
Low power LPO design up to 50% reduced consumption
Low latency optical signal processing
Heterogeneous laser integration
224Gpbs PAM4 modulation
Optical Engines for Co-Packaged Optics
Scale-up and scale-out NPC Series chiplets with highly integrated optical engine innovation enabling high-density 1.6Tbps to 6.4Tbps interconnect for CPO/NPO and in-field serviceability applications.
CPO/NPO connectivity for GPU/Switch/ASIC with integrated optical signal processing (OSP) engine
High capacity, low latency up to 10Tbps for scale out CPO
From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
Optical Engines for Co-Packaged Optics
Scale-up and scale-out NPC Series chiplets with highly integrated optical engine innovation enabling high-density 1.6Tbps to 6.4Tbps interconnect for CPO/NPO and in-field serviceability applications.
CPO/NPO connectivity for GPU/Switch/ASIC with integrated optical signal processing (OSP) engine
High capacity, low latency up to 10Tbps for scale out CPO
From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
Award-Winning Optical Innovations
We’re honored by the industry recognition of our breakthrough and disruptive solutions in silicon photonics
2024 ECOC Innovation Award
LightWave+BTR 4.5 Review
Leading Lights Innovation
