Simplify Optical DSP Scale-Out

The NPG10204 transceiver-optimized photonic IC chipset for DSP-based pluggable modules enables overall power savings and accelerates the path to infrastructure leveraging the full  benefit of integrated silicon photonics.

Advantages

Experience gains from the industry-first advanced transmitter-on-chip for reduced power, latency and complexity in scale AI data center digital interconnect.

New Power Lows

Consumption drop to 2.5W for renewed energy efficient DSP performance

Latency Improvement

1.6T 224Gbps with PAM4 modulation

icon representing a wafer of silicon photonics chips
High Yield Design

KDG with highly integrated lasers, modulators, converters and control logic

Next Gen DSP Optical Engine

Get the SiP chip for lower power operation in DSP pluggables with an unmatched combination of integration, power efficiency, and performance that sets a new benchmark for AI-driven networking.

Optimize DSP Interconnect

Overcome power and latency bottlenecks in traditional data center infrastructure with next generation optical DSPs. The NPG10204 PIC transmitter on chip is designed to scale with dramatic gains in performance and energy efficiency.

Efficient E-O Conversion

Advanced integration of EA modulators with low DSP drive voltage for greater system energy efficiency.

Advantage: Integrated Laser PIC

Monolithic laser integration design delivers maximum performance with high coupling efficiency and low loss at low power.

  • Simplified PIC assembly eliminating multiple steps and equipment – no laser-lens attach, no wire-bonder, no auto-aligner required.

  • Fast manufacturing at high reliability and yield with 100% known good die (KGD) post burn-in PICs.

  • PIC power reduction from low loss and >90% coupling efficiency versus externally-coupled DFB lasers.

Contact us

Start your transition today to advanced optical interconnect.

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