The industry is increasingly adopting silicon photonics to overcome power and capacity limitations burdened by AI across data centers worldwide. Recognition that silicon photonic integrated circuit (SiPIC) solutions offer higher bandwidth and improved energy efficiency compared to traditional electronic interconnects is taking hold as demand for AI-driven data tools and content continues to grow exponentially.
This Fall saw our CEO and CTO on many stages as industry influencers around the globe from Denmark to Spain, and the Silicon Valley to Japan! Hyperscalers and data centers are evaluative a range of silicon photonics to solve data processing limitations in the new AI factory. And #TeamNP is doing our part to close the consideration gap and inform decision makers at system integrators, infrastructure architects, and OEM partners on the advantages of advanced optical signal processing.
If you’ve missed out don’t worry. There are two upcoming events where you can hear from CTO Yosef Ben Ezra in Israel and California.
Here’s a recap of appearances by both Yosef and CEO Yaniv Ben Haim, where they participated in both product and ecosystem influence as key contributors to the growing global shift from traditional electrical interconnect to the more energy efficient, AI-era of optical connectivity.
Outstanding Recognition for Photonics Innovation
The 14th IEEE CPMT Symposium Japan 2025 was an inspiring week of insight and industry building. We are proud of the honor bestowed upon Co-Founder and CTO Prof. Yosef Ben Ezra as he was honored as an invited speaker by the EPS-IEEE Electronics Packaging Society for his contribution to the success of the symposium.
Yosef’s decades of innovation in photonics R&D, and integrated optical systems and of the groundbreaking technology in our industry-leading PIC solutions helping push interconnect for AI into improved power and bandwidth performance.
At the event Yosef presented our latest advances in:
• Integrated photonics architectures for next-gen AI data centers for pluggable and CPO/NPO
• Heterogeneous laser integration enabling zero-alignment, zero-lens, zero-isolator PIC assembly
• The NPG102 PIC platform and the advantages for both DSP-based and LPO+™ chip designs
OSP all-optical processing driving new scale achievements in network infrastructure
Strengthening the Silicon Photonics Economy for AI
One year ago, we were only an observer of Optica’s Global Photonics Economic Summit as Jose Pozo and team led a push to bring international attention to the growth of photonics in the data center. This year we became visible participants in the effort to grow the silicon photonics economy.
CEO Yaniv was invited to join the panel “Scaling Photonics Innovations in a Changing Global Economy” with a collection of visionary leaders from Quantum Computing Inc., ESTEL, Thema Foundries, Tarta, and Iradion Laser and moderated by industry influencer moderated by Mike Powell.
The key takeaway for the audience and participants was clear: photonics is the backbone of the AI , and the future for SiP as a mainstream force is taking shape.
Efficiently and effectively powering next-generation data centers for a more sustainable global connectivity will be defined as we advance the technology to scale power savings and performance in parallel.
As our volume production efforts begin entering the market, our OSP-integrated laser PICs for DSP and LPO+™ pluggable transceivers are introducing new possibilities based on integration innovations for in-demand AI infrastructure.
Another key takeaway: The collaboration and momentum across Europe and globally are truly inspiring, and we will continue to be an active and vocal contributor to the discussion among the growing and exceptional group of innovators and leaders.
PECC: Silicon Photonics Takes Center Stage for Interconnect at 1.6T and 3.2T
From Spain to Sunnyvale, CTO Yosef took the stage alongside xxx from xxx on the hot topic of scalable photonic systems. He presented on the impact that advances from highly integrated photonics in our approach to SiP chip design is having on scale out and scale up strategies for interconnect.
The event known for high-value interactions and candid conversation is a marquee Optica event in Silicon Valley each Fall where senior executives and technologists can address industry-wide challenges as photonics evolve deeper into the core of AI and data center infrastructure.
This session, System Implementation of Scalable Photonic Systems, focused on both challenges and advancements in the photonics industry and discussed breakthroughs in high-performance optical connectivity as well as photonic Integrated Circuit (PIC) design tools, and next-generation characterization platforms.
With our patented technology in development under the leadership of its creator, Yosef contributed disruptive ideas to the audience in alignment with our commitment to a paradigm shift in optical connectivity.
Fall Presentation Kick-Off: OSP Spotlight at ECOC 2025
In addition to our private demos and a public announcement with Optica’s Jose Pozo, we made a first-ever public demonstration a live eye diagram with at 448G per lane as part of CTO Yosef’s Product Focus Theater appearance at ECOC.
In the session Essential Optical PICs for Data Center Scale Out, we represented new benchmarks in reliability, performance, and manufacturability for PIC-driven optical connectivity for improved communications performance across the AI-factory. Yosef highlighted how our NPG102 PIC product line delivers on the broad needs today in AI-scale interconnect with:
• Low-power, highly integrated optical head PICs for DSP-based 1.6T pluggables offering mature manufacturing yield and shorter time-to-market with simplified production.
• Award winning LPO+™ optical signal processor PIC for modules at 800G and 1.6T with integrated optical equalization that exceed critical standards with interoperability at yield enhancing margins.
• An LPO+ receiver on chip PIC (AKA Rockstar) that leverages the programmable optical processor with optimized channel equalization capabilities for receiver-side linear-direct-drive pluggable optics (LPO).
The continuing AI workload surge is driving urgent data center demand for low-power, high-speed optical interconnect solutions. A critical path to addressing the challenge is building awareness of valuable innovative in silicon photonic ICs for today’s 1.6T and 800G AI infrastructure as well as how optical interconnect advances are progressing for the 3.2T and 6.4T capabilities of this decade and next.
So watch for us in 2026 as we continue to lend our voice to the building push for a more mature and productive semiconductor and photonics ecosystem driving investment, manufacturing, and collaboration in Europe and around the world. We will continue to speak out because we so strongly believe that climate responsible data center evolution is attainable with our highly integrated silicon photonics innovations that enable AI factories to make the shift from electrical to optical at scale.
