Today in conjunction with the 50th gathering of the ECOC Exhibition in Frankfurt, Germany, we announced our collaboration agreement with SoftBank Corporation. Our joint effort will advance photonics for LPO, CPO and all-optics switch fabric for AI-RAN in the data center.
As a growth silicon photonics company developing innovative all-optics connectivity solutions, our strategic partnership with the global technology provider is a significant milestone on our path to providing a new generation of energy efficient and high-performance data transmission chips. By targeting improved GPU/CPU/switch fabric performance with PIC and low latency optical connectivity, our joint initiative with SoftBank will also addresses power consumption and capacity bottlenecks in AI cluster workloads.
Critical to this photonics-electronics convergence is our patented optical SerDes (serializer/deserializer) enabling higher density and low latency data transfer in mobile fronthaul and data center processing.
This announcement signals our contributions to the advancement of CPO with optical signal processing breakthroughs that address AI and high-performance compute demands. And as we continue to push the boundaries of optical in data transmit infrastructure, our collaboration with SoftBank represents our strong focus on customer-driven development that delivers in-demand market solutions.
See comments from leaders at both companies below and read the complete news at these links:
Softbank and NewPhotonics Announce Collaboration on Advanced Photonics Technology for LPO, CPO and All-Optics Switch Fabric Targeting AI-RAN: Collaboration Agreement Targets Next Generation Data Centers vRAN to Fronthaul with All-Optical Transmission and Switching
NewPhotonics Wire Release: https://www.prnewswire.com/news-releases/softbank-and-newphotonics-announce-collaboration-on-advanced-photonics-technology-for-lpo-cpo-and-all-optics-switch-fabric-targeting-ai-ran-302255690.html
SoftBank Wire Release: https://www.softbank.jp/en/corp/news/press/sbkk/2024/20240924_01/
Ryuji Wakikawa, Head of SoftBank Research Institute of Advanced Technology, said:
“We believe this partnership with NewPhotonics is necessary for next generation infrastructure. By collaborating, we envision a transformation in AI data center and mobile fronthaul infrastructure with optical-electronics convergence technologies that enhances speed, distance limit, capacity, and, most importantly, leads to sustainability gains giving SoftBank a significant advantage and market leadership.”
Yaniv Ben Haim, CEO of NewPhotonics added “our new collaboration agreement with Softbank marks a significant milestone for our company and the industry to advance optical interconnect technology in CPO and pluggable that address the needs of modern compute and AI infrastructure. We remain committed to breaking the limits of optical communication with lowered latency and power at scalable distances. This partnership exemplifies our confidence in the impact of all-optical connectivity on the future of AI and 6G with our patented photonics innovations.”
