Position Details:
Lead Process Engineer
About The Position
About The Position
NewPhotonics is disrupting data center processing with novel photonic engines solving the power and performance challenges.
We are seeking a an energetic and hands- on Lead process Engineer to join our OPS team.
The ideal candidate is a self-motivated hands-on Engineer capable of full process definition, and CM bring up from NPI to Mass Production.
Requirements
- 7 years + as process eng in semiconductor/ optical communication
- B.Sc./M.Sc. in science/engineering studies
- Highly motivated, organized, and independent.
- Excellent English written and verbal communication skills
Required knowledge in:
- ASIC packaging, Bumping.
- Optical coupling
- FlipCHip/ Wire bonding
- mSAP/HDI PCB design.
- GRnR , Machine introduction.
- FIB/TEM/cross section , Silicon Failure analysis.
- Manufacturing knowledge of SAP, mSAP
Key Responsibilities:
- Full Process rout definition. Product introduction to the OSATs.
- Process validation. I.e. : Wire bonding
- SOW preparation & execution
- OSAT/CM NPI bring-up and enable HVM capacity.
- Custom Machinery introduction.
- Create customer assembly guidance (Flip chip, mSAP, Dipping)
- Failure Analysis.
- Process experiment and Assembly Tech enablement.
Advantage:
- Mechanical design capabilities in SOLID
- SiPh, Optics background.
- Knowledge of GR468
- Oracle Agile.